“Lab4MEMS II - The design of micro-mirrors and pico-projectors”, Portelli B., Farrugia R., Grech I., Casha, O., Micallef J., Gatt E., Engineering Today, June, 2016 Malta (University of Malta)
“Characteristic void formation and the impacts on the IMC growth in the Cu-Sn System”, G. Ross, V. Vuorinen & M. Paulasto-Kröckel, Journal of Alloys and Compounds, 677 (2016) 127-138 (Aalto University)
“Mechanical Optimisation of an Electrostatically actuated Scanning Mirror”, Farrugia R., Grech I., Casha O., Micallef J., Gatt E., WICT 2016, Workshop on ICT, June, 2016 Malta (University of Malta)
“Design of a Gimbal-less Electrostatically actuated Scanning Mirror:, Portelli B., Grech I., Casha, O., Micallef J., Gatt E., WICT 2016, Workshop on ICT, June, 2016 Malta (University of Malta)
“Design of a three axes Magnetically actuated Scanning Mirror’, Amato M., Grech I., Casha, O., Micallef J., Gatt E., WICT 2016, Workshop on ICT, June, 2016 Malta (University of Malta)
“Vertical cracking of Cu-Sn solid-liquid interdiffusion bond under thermal shock test”, A. Rautiainen, V. Vuorinen, M. Paulasto-Kröckel; nanoFIS 2016, International Conference Integrated Functional nano Systems, June 27-29, Graz, Austria, Accepted Journal article, Materials Today Proceedings (Aalto University)
“Optimization of contact metallizations for reliable wafer level Au-Sn bonds”, Vuorinen V., A. Rautiainen, H. Heikkinen, M. Paulasto-Kröckel; ESREF 2016 The 27th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, September 19-22, Halle (Saale), Germany (Aalto University)
“Optimization of contact metallizations for reliable wafer level Au-Sn bonds”, Vuorinen V., A. Rautiainen, H. Heikkinen, M. Paulasto-Kröckel; Journal article: Microelectronics Reliability 64, p. 676-680 (Aalto University)
“Thermodynamic Reassessment of the Au-Pt-Sn System and Experimental Investigation of the Au-20wt.%Sn|Pt Interconnection”, H.Q. Dong, V. Vuorinen, M. Paulasto-Kröckel, Journal of Alloys and Compounds 688 (2016) 388-398 (Aalto University)
“GHz-SAM analysis of Cu-Sn interfacial voiding”, G.Ross, S.Brand, V.Vuorinen, M. Petzold and M. Paulasto-Kröckel, Accepted to Applied Physics Letters (Aalto University)
“Hardness, elastic modulus and wear resistance of hafnium oxide-based films grown by atomic layer deposition”, Maria Berdova, Xuwien Liu, Claudia Wiemer, Alessio Lamperti, Grazia Tallarida, Elena Cianci, Marco Fanciulli, Sami Franssila, Journal Paper planned to be submitted to thin solid films (CNR-IMM-MDM)
“The role of the oxydizing agent on the crystallization of HfO2 grown by low temperature TEMAHf based process on different substrates”, C. Wiemer, S. Vangelista, A. Lamperti, E. Cianci, Poster at ALD Conference, AVS Atomic layer Deposition Conference, July 23-27 2016, Dublin Ireland (CNR-IMM-MDM)
“MOEMS global and next future scenarios”, Luca Zanotti, Invited Speech at the 1st Lab4MEMS2 Workshop: Next-Generation Optical MEMS Technologies and Devices during the ESSDERC and ESSCIRC conference 2016 12-15 September 2016, Lausanne, Switzerland, (ST-I)
“Innovative materials for MOEMS devices”, Claudia Wiemer, Invited Speech at the 1st Lab4MEMS2 Workshop: Next-Generation Optical MEMS Technologies and Devices during the ESSDERC and ESSCIRC conference 2016 12-15 September 2016, Lausanne, Switzerland (MDM, IMM-CNR)
“Non-linear mechanical behavior of electrostatically actuated micromirrors”, Attilio Frangi, Invited Speech at the 1st Lab4MEMS2 Workshop: Next-Generation Optical MEMS Technologies and Devices during the ESSDERC and ESSCIRC conference 2016, 12-15 September 2016, Lausanne, Switzerland (Politecnico Di Milano)
“Application and control of the MOEMS microscanners”, Teodor Gotszalk, Invited Speech at the 1st Lab4MEMS2 Workshop: Next-Generation Optical MEMS Technologies and Devices during the ESSDERC and ESSCIRC conference 2016 12-15 September 2016, Lausanne, Switzerland (Wroclaw University of Technolgy)
“Concepts for optical microsystems (MOEMS) and their miniaturization limits”, Hans Peter Herzig, Invited Speech at the 1st Lab4MEMS2 Workshop: Next-Generation Optical MEMS Technologies and Devices during the ESSDERC and ESSCIRC conference 2016, 12-15 September 2016, Lausanne, Switzerland (EPFL)
“Integration issue in MEMS/MOEMS technologies in Industry 4.0 era”, Piotr Grabiec, Invited Speech at the 1st Lab4MEMS2 Workshop: Next-Generation Optical MEMS Technologies and Devices during the ESSDERC and ESSCIRC conference 2016, 12-15 September 2016, Lausanne, Switzerland (ITE)
“New approach for a multi-cantilever arrays sensor system with advanced MOEMS readout”, F. Ivaldi, T. Bieniek, P. Janus, J. Zając, P. Grabiec, W. Majstrzyk, D. Kopiec, T. Gotszalk accepted for oral presentation during the ESSDERC-MEMS, NEMS, Bio sensors and Display Technologies Track in MEMS and Microfluidics Session at the ESSDERC and ESSCIRC conference 2016, 12-15 September 2016, Lausanne, Switzerland (ITE)
“Innowacyjny kompaktowy system czujnikowy oparty o matryce mikrobelek z optycznym układem odczytowym” (“Microcantilever arrays base innovative compact sensor system with optical red-out”) Tomasz Bieniek, Francesco Ivaldi, Paweł Janus, Jerzy Zając, Piotr Grabiec, Wojciech Majstrzyk, Daniel Kopiec, Teodor Gotszalk; poster at ELTE'2016 - XII Konferencja Naukowa Technologia Elektronowa, 11-14 September 2016, Wisła, Poland (ITE)
“Next generation micro-optical MEMS, micro-mirrors and pico-projectors - LAB4MEMS II PROJECT” Tomasz Bieniek, Francesco Ivaldi, Piotr Grabiec, Jerzy Zając, Paweł Janus, poster at ELTE'2016 - XII Konferencja Naukowa Technologia Elektronowa, 11-14 September 2016, Wisła, Poland (ITE)
“Nanometric Scale in Solid State Integrated Circuits: Features and Analytical Techniques”, Zanotti L.; Keynote speech at NFFA Europe, nanoscience foundries and fine analysis, April 11-12 2016, Milan, Italy (ST-I)
“Applications of PZT-based micromirrors”, T. Bakke, P. Widdendorp, Z. Skokic, J. Gjessing, F. Tyhold, A. Vogl, Conference Paper at PiezoMEMS 2016, 5th International Workshop on Piezoelectric MEMS, May 24-25, 2016 Grenoble (France), (SINTEF)
“Industry 4.0 challenges for microelectronic and sensor technologies”, P. Grabiec, Invited Speech at 14th International Conference on Optical and Electronic Sensors COE'2016, 19-22 June 2016, Gdansk, Poland (ITE)
“Innovative multi-cantilever array sensor system with MOEMS read-out”, F. Ivaldi, T. Bieniek, P. Janus, P. Grabiec, W. Majstrzyk, D. Kopiec, T. Gotszalk, presentation at 14th International Conference on Optical and Electronic Sensors COE'2016, 19-22 June 2016, Gdansk, Poland (ITE)
“Innovative multi-cantilever array sensor system with MOEMS read-out”, F. Ivaldi, T. Bieniek, P. Janus, P. Grabiec, W. Majstrzyk, D. Kopiec, T. Gotszalk, SPIE journal paper at 14th International Conference on Optical and Electronic Sensors COE'2016, 19-22 June 2016, Gdansk, Poland (ITE)
“Novel MOEMS read-out system for multi-cantilever sensor arrays”, F. Ivaldi, T. Bieniek, P. Grabiec, W. Majstrzyk, D. Kopiec, T. Gotszalk; presentation at 18th European Conference on Integrated Optics (ECIO 2016), 18-20 May 2016, Warsaw, Poland (ITE)
“A novel approach for comb-drive driving systems used in MOEMS”, Magdalena EKWIŃSKA, Dariusz SZMIGIEL, Tomasz BIENIEK, Francesco IVALDI, presentation at 18th European Conference on Integrated Optics (ECIO 2016), 18-20 May 2016, Warsaw, Poland (ITE)
“Advanced protective coatings by low temperature atomic layer deposition of HfO2 on Al surfaces for micro-mirror applications”, C. Wiemer, E. Cianci, A. Lamperti, G. Tallarida, M. Berdova, S. Franssila, M. Zanuccoli, C. Fiegna, L. Lamagna, S. Losa, S. Rossini, R. Somaschini, S. Gioveni, CIMTEC, 5th International Conference Smart and Multifunctional Materials, Structures and Systems of CIMTEC 2016 June 5-9, 2016, Perugia, Italy (CNR-IMM-MDM)
“Analysis of Dynamic Deformation in 1-D Resonating Micromirrors”, Farrugia R., Grech I., Casha, O.,Micallef J., Gatt E., Conference Paper at DTIP 2016, Design, Test, Integration & Packaging of MEMS/MOEMS, May 31, 2016 Budapest, Hungary (University of Malta)
“MEMS/MOEMS System Integration and Packaging”, L.Zanotti, University of Graz, 27-29 June 2016; 2nd International Conference nanoFIS 2016 - Integrated Functional nano Systems (ST-I)
“Vertical cracking of Cu-Sn solid-liquid interdiffusion bond under thermal shock test”, Rautiainen A.. Vuorinen, M. Paulasto-Kröckel, Conference Paper presented at University of Graz, 27-29 June 2016; 2nd International Conference nanoFIS 2016 - Integrated Functional nano Systems (Aalto University)
“Vertical cracking of Cu-Sn solid-liquid interdiffusion bond under thermal shock test”, A. Rautiainen, V. Vuorinen, M. Paulasto-Kröckel; Accepted and submitted to Materials Today Proceedings (Aalto University)
Trade show attendance at Photonics West 2016 to promote microspectrometer activities, February 2016 (VTT)
“Key parameters influencing Cu-Sn interfacial void formation”, G. Ross, V. Vuorinen and M. Paulasto-Kröckel, Presentation at EPTC 2016 - 18th Electronics Packaging Technology Conference, 30th Nov – 3rd Dec 2016, Suntec Singapore (Aalto University)
“Interfacial void segregation of Cl in Cu-Sn micro-connects”, G. Ross, X. Tao, M. Broas, N. Mäntyoja, V. Vuorinen, A. Graff, F. Altmann, M. Petzold, and M. Paulasto-Kröckel, Journal Paper, Submitted to ELECTRONIC MATERIALS LETTERS (Aalto University)
“An innovative multi-cantilever arrays sensor system implementation with advanced MOEMS readout for multidisciplinary sensor application”, Bieniek T., Janus P., Grabiec P., Poster presented at ITMED 2016 & NANOMED 2016 X Międzynarodowe Forum Innowacyjne Technologie dla Medycyny (ITMED 2016) connected with z 4th International Conference on Nanotechnology in Medicine (NANOMED 2016), 7-9 November 2016, Warsaw, Poland (ITE)
“Next generation micro-optical MEMS micro-mirrors and pico-projectors – LAB4MEMS–II project” Bieniek T., Poster presented at ITMED 2016 & NANOMED 2016 X Międzynarodowe Forum Innowacyjne Technologie dla Medycyny (ITMED 2016) connected with z 4th International Conference on Nanotechnology in Medicine (NANOMED 2016), 7-9 November 2016, Warsaw, Poland (ITE)
“Geometric optimization of magnetically actuated MEMS micromirrors”, Pieri F., Conference Paper presented at MME 2016 - 27th Micromechanics and Microsystems Europe 28-30 August 2016, Cork, Ireland (University of Pisa, IUNET)
“MOEMS FPI sensors for NIR – MIR microspectrometer applications”, A. Akujärvi, B. Guo, R. Mannila, A. Rissanen, Conference Paper, presented at SPIE Photonics West 2016 OPTO MOEMS and Miniaturized Systems XV, San Francisco, California, United States, February 13, 2016 (VTT)
“Products & Technology: Lab4MEMS II participation”, Besi N.V., Company www pages (BESI)
Flyer: “Lab4MEMS II participation”, Besi N.V., Exhibition stand, presented at Semicon Europe 2016, 25-27 October 2016, Grenoble, France (BESI)
Poster wall at Besi Austria facility: Lab4MEMS II participation, Besi Austria Gmbh (BESI)
“Lab4MEMS II project”, Zanotti L., Poster presented at ENF2016 - European Nanoelectronics Forum 2016, November 23-24, Rome, Italy (ST-I)
“Microstructural evolution and mechanical properties in (AuSn)eut-Cu interconnections”, H.Q. Dong, V. Vuorinen, T. Laurila and M. Paulasto-Kröckel,, J. Electronic Materials. 45,10, 2016 (Aalto University).
Microstructural evolution and mechanical properties of Au-20wt.%Sn|Ni interconnection, H.Q. Dong, V. Vuorinen, X.W. Liu, T. Laurila, J. Li, M. Paulasto-Kröckel, J. Electronic Materials, 45, 1, 2016 (Aalto University)
Doctoral dissertation; Hongqun Dong, Design of the Contact Metallizations for Gold-Tin Eutectic Solder-A Thermodynamic-Kinetic Analysis, http://urn.fi/URN:ISBN:978-952-60-6995-1 (Aalto University)
“A refined model for piezoelectric composite beams”, F. Pieri, Conference Paper presented at MME 2016 - 27th Micromechanics and Microsystems Europe 28-30 August 2016, Cork, Ireland (University of Pisa, IUNET);
“Evaluation of Characterization Methods for Cu-Sn Micro-Connects”, Nikolai Mäntyoja, February 2016, http://urn.fi/URN:NBN:fi:aalto-201603291548 (Aalto University, M.Sc Thesis) ;
“Structural analysis of interfacial voiding in the Cu-Sn System”, G. Ross, V. Vuorinen, N. Mäntyoja, M. Broas, M. Paulasto-Kröckel; ESTC 2016, The 6th Electronics System Integration Technologies Conference, September 13 to 16, Grenoble, France. (Aalto University, Conference Paper);
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