Lab4MEMS II dissemination in 2018:

• “Wafer-level AuSn/Pt solid-liquid interdiffusion bonding”, A. Rautiainen, V. Vuorinen, H. Heikkinen, M. Paulasto-Kröckel, IEEE Transactions on Components, Packaging and Manufacturing Technology (Volume: 8, Issue: 2, Feb. 2018), DOI: 10.1109/TCPMT.2017.2780102 (Journal paper, Aalto University);
• “Smart Materials in ST-MEMS vision”, Marco Ferrera, Presentation at "Workshop: Enabling Infrastructures for Emerging Technologies”, Politecnico di Milano, Milano, Italy, 19 Feb. 2018 (Invited Speech, ST-I);
• “Technological Application Fields for MEMS Sensors and Actuators” Zanotti L.  Sanginario A., Presentation presented at "Workshop: Next-Generation MEMS/MOEMS Technologies and Devices” at Politecnico di Torino, Italy, 12 January 2018, (Invited Speech, ST-I, Polito);
• “A Fast Multiobjective Optimization Strategy for Single-Axis Electromagnetic MOEMS Micromirrors”, Pieri F., Cliea A., Journal Paper, Published in Micromachines 9 (1), 2018 (Journal paper, Uni. Pisa);
• “Theoretical and Finite Element Analysis of Dynamic Deformation in Resonating Micromirrors”, Farrugia R., Camilleri D., Grech I., Casha, O., Micallef J., Gatt E., Microsystem Technology (2018) 24: 445. https://doi.org/10.1007/s00542-017-3335-7 (Journal paper, University of Malta);
• “Instytut Technologii Elektronowej Research Activities and Opportunities for Collaboration”, Bieniek T., Janczyk. G., Successful R&I in Europe 2018   - 9^th European Networking Event 15-16 March 2018, Dusseldorf, Germany (Presentation, ITE);
• Polish Patent: Grabiec P., Bieniek T., Janus P., Zając J., Ivaldi F., Gotszalk T., Majstrzyk W.: "Układ do optycznego pomiaru stopnia i częstości wychylenia elementów ruchomych w strukturach mikro- i nanomechanicznych." (No 227665) (ITE);
• “Advanced protective coatings for reflectivity enhancement by low temperature atomic layer deposition of HfO₂ on Al surfaces for micromirror applications”, E. Cianci, A. Lamperti, G. Tallarida, M. Zanuccoli, C. Fiegna, L. Lamagna, S. Losa, S. Rossini, F. Vercesi, D. Gatti, and C. Wiemer, submitted to: Sensors and Actuators A (Journal Paper, CNR);
• “Lab4MEMSII Talk to Engineering Students”, Portelli B., R. Farrugia, (Presentation, University of Malta);
• “Air Damping Analysis in Resonating Micro-mirrors”, Farrugia R., Portelli B., Grech I., Camilleri D., Casha, O.,Micallef J., Gatt E., to be presented at DTIP 2018 - Design,Test, Integration & Packaging of MEMS/MOEMS, May 22 - May 25, 2018, Rome, Italy (Conference Paper, University of Malta);
• SINTEF has created a web-page www.piezomicrosystems.com, with updates on its piezoMEMS technology, featuring also results from Lab4MEMS II (www, Sintef);
• “C-SOI as a New Generation MEMS Sensor Platform, Current Status and Challenges”, Markku Tilli, 7^th CAM Workshop, Halle, Germany, 25.-26.4.2018 (Keynote Speech, OKM);
• “Consumer electronics is redesigning our cars? Challenges of integrated technologies for sensing, computing and storage,”  F. Pieri, C. Zambelli, A. Nannini, P. Olivo, S. Saponara, Journal Paper, accepted for publication in IEEE Comsumer Electronics Magazine, 2018 (University of Pisa, IUNET);
• Planned paper/presentation based on Lab4MEMS II results for next IEEE Sensors conference in 2018 (http://ieee-sensors2018.org/) (CEA);
• “Process Integration and Reliability of Wafer Level SLID Bonding for Poly-Si TSV capped MEMS”, V. Vuorinen, G. Ross, J. Decker, H. Viljanen and M. Paulasto-Kröckel, Accepted to ESTC2018, 7^th Electronics System-Integration Technology Conference,  September 18-20, 2018, Dresden, Germany (Aalto University, Presentation);
• “The effect of platinum contact metallization on Cu/Sn bonding”, A. Rautiainen, G. Ross, H.Q. Dong, V. Vuorinen, M. Paulasto-Kröckel; Submitted to Journal of Materials Science: Materials in Electronics, May 2018 (Aalto University, Submitted, Journal paper);
• Automotive Electronics Council Reliability Workshop, April 2018, Novi, Michigan, USA (KLA-Tencor, Exhibition);
• SEMICON China, March 2018, Shanghai, China (KLA-Tencor, Exhibition);
• "Mode Coupling and Parametric Resonance in Electrostatically Actuated Micromirrors", A Frangi, A Guerrieri, N. Boni, R Carminati, M. Soldo, G Mendicino, IEEE Transactions on Industrial Electronics 65 (7), 5962-5969, 2018; (Journal paper, Politecnico di Milano);
• "Mechanics of Microsystems", Corigliano, R. Ardito, C. Comi, A. Frangi, A. Ghisi, Stefano Mariani, ISBN: 978-1-119-05383-5, 464 pages, Wiley, January 2018 (Book, Politecnico di Milano);
• Symposium “Micro and Nano Electro-Mechanical Systems”, A. Frangi, 10^th European Solid Mechanics Conference, Bologna, Italy, July 2 - 6 2018, (Symposium, Politecnico di Milano);